3D TIMON-Module
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3D TIMON-PACK - Packing and Cooling Analysis Module
3D TIMON-PACK simulates packing process, during which the packing pressure is applied to compensate for the volumetric shrinkage as the plastic cools, and cooling process during which the plastic temperature decreases below mold eject temperature and provides plastic temperature and pressure profiles. These pressure and temperature profiles are used to evaluate specific volume through examination of a PVT graph, which illustrates a characteristic PVT relationship, which in turn yield distribution of volumetric shrinkage strain. The distribution of volumetric shrinkage strain is attributed to thermal contraction, which is passed to warpage analysis as a loading condition.
3D TIMON-PACK requires analysis results of 3D TIMON-FLOW.
3D TIMON-PACK Analysis Results
- Shrink strain
- Pressure at shrink start (MPa)
- Specific volume at shrink start (cm^3/g)
- Average temperature at shrink start (°C)
- Shrink start time (sec)
- Mold temperature gradient (°C)
- Pressure (MPa)
- Specific volume (cm^3/g)
- Thickness average temperature (°C)
- Temperature (°C)
- Viscosity (Pa-sec)
- Shear rate (/sec)
- Shear stress (Pa)
- Shear stress (Pa)
- Velocity (mm/sec)